1.鍾官榮、饒銘書、林家緯、王群弘，“取放型機械手臂之健康狀態即時預診(In-line PHM)”，參加「全國大專院校AI智動化設備創作獎」，獲得入選決賽資格，中華民國一百一十年六月。

2.鍾官榮、黃建樺，“應用長短期記憶機器學習模型與邊緣運算於晶圓取放機械手臂之即時預測性維護研究”，參加「TSPE精密工程專題與論文獎」，獲得入選決賽資格，中華民國一百零九年十月。

3.吳嘉哲、鍾官榮，“新型可攜式水中重金屬檢測系統之開發(MOST106-2622-E-005-015-CC2)”，榮獲科技部工程司108年度「產學合作計畫成果發表暨績效考評會」機電能源領域海報展示特優獎，中華民國一百零八年十一月。

4.吳嘉興、王順正、鍾官榮、鄧妤庭，“車用ADAS晶片的可靠度分析與評估”，參加「中華民國品質學會第55屆年會暨2019國際品質管理研討會(ISQM)」，獲得聚陽產學應用論文獎佳作，中華民國一百零八年十一月二日。

5.Invited Speaker, “Lifetime Prediction of Li-ion Batteries Using the Gamma Process Modeling Through the Accelerated Degradation Measurements”, The 2018 International Conference on Green Electrochemical Technologies (2018 ICGET-Tw), Tainan, Taiwan, Nov. 22-24, 2018.

6.張煜森、鍾官榮，“利用人工智慧法組合學習過程進行咖啡機的預測維護分析”，參加「中華民國品質學會第53屆年會暨2017國際品質管理研討會(ISQM)」，獲得聚陽產學應用論文獎第二名，中華民國一百零六年十一月二十五日。

7.指導李奕儒、黃建樺、甘佐祥、張煜森與鄭惠敏以“半導體產業傳送晶圓機械手臂之預後系統開發”為題，參加「2017全國大專院校產學創新實作競賽」入圍決賽並獲得“最佳創新獎”，中華民國一百零六年十一月二十三日。

8.指導吳柏翰、何照偉、李奕儒、張煜森與龎在偉以“半導體生產設備之機械手臂健康狀態預診系統開發與實作”為題，參加『第六屆中興大學「精密工具機與智慧化技術」專題實作競賽暨程泰集團「精密工具機與智慧化技術」專題實作獎』入圍決賽，中華民國一百零六年十月二十一日。

9.研究團隊與瑞霸生技合作進行奈米電化學檢測晶片高值化封裝技術開發、量測品質與可靠度分析，產品及企業榮獲第「13屆國家新創獎」之“企業初創獎等四獎項”，中華民國一百零五年十二月二十二日。

10.指導邱忠賢、蕭又慈與王任杰以“可調式潤滑冷卻噴霧器之研製”為題，參加「2013第三屆全研科技論文獎」獲得“大專組專題競賽銅研獎”，中華民國一百零二年十月十九日。

11.鍾官榮，101學年度績優導師，國立彰化師範大學，彰化，中華民國一百零一年十二月十九日。

12.Honorable Mention. Sen-Chou Tsai, Nien-Chung Wang, and Kuan-Jung Chung, “Design and Reliability Assessment of Enhanced RFID Locks for Meters”, 1^st Global Competition on Systematic Innovation, The Society of Systematic Innovation, May, 2011.

13.Top 10 Final List Poster. C.-J. Tong, M-T. Lin, Y.-T. Chen, Kuan-Jung Chung, and J.-S. Hsu, “Novel Mechanical Properties Measurement of Thin Films Using Paddle Cantilever Deflection”, ThinFilms 2008 and NanoMan 2008, 13-16 July, 2008, Singapore.

14.High Commended Award. L. Yang, J. B. Bernstein, and K. Chung, “The Impact of Lead-Free Soldering on Electronic Packages”, Microelectronic International, Literati Club, 2002.

1.Ping Wun Huang, and Kuan-Jung Chung, “Task failure prediction for wafer-handling robotic arms by using various machine learning algorithms”, Measurement and Control, Vol. 55, Issue 3-4, pp.1-10, 2021. (SCIE, 2020 IF: 1.492; Ranking by Subjects: Instruments & Instrumentation 41/64, Automation & Control Systems 43/63).

2.Yu-Chang Lin, and Kuan-Jung Chung, “Lifetime Prognosis of Lithium-Ion Batteries Through Novel Accelerated Degradation Measurements and a Combined Gamma Process and Monte Carlo Method”, Applied Sciences, Vol. 9, No. 3, pp. 559, 2019 (SCIE, 2018 IF:2.217; Ranking by Subjects: Engineering 48/270, 82% ).

3.Kuan-Jung Chung, C.F. Lin, and W.C. Chiang, “Mechanical behavior of copper thin films subjected to various strain rate loadings”, The Transactions of the Canadian Society for Mechanical Engineering, Vol.37, No. 3, pp.861-871, 2013. (SCI, 2012 IF: 0.302)

4.Kuan-Jung Chung, Martin Peckerar, Joseph B. Bernstein, “Design Optimization of Laser-Induced Microbridges for Low Resistance Interline Connections in ICs”, Microelectronic Engineering, Vol. 103, pp. 70-75, 2013. (SCI, 2012 IF: 1.224)

5.Chia-Che Wu, Chun-Hung Hsueh, Ya-Ting Chang, Chueh-Tang Chang, and Kuan-Jung Chung, “A Patterning Technique of Lead Zirconate Titanate Thin Film by Ultraviolet-light”, Microsystem Technologies, Vol. 19, No. 6, pp 853-859, 2013. (SCI, 2012 IF: 0.827)

6.Taco Chen, Ming-Tzer Lin, and Kuan-Jung Chung, “Linear Energy Control of Laser Drilling and Its Application in The Repair of TFT-LCD Bright Pixels”, Microsystem Technologies, Vol.18, No. 11, pp 1909-1915, 2012. (SCI, 2012 IF: 0.827)

7.Kuan-Jung Chung, and J. B. Bernstein, “Experimental Investigation of the Optimal Laser-Induced Microbridges”, Precision Engineering, Vol.34, No. 3, pp. 578-585, Jul. 2010. (SCI, 2012 IF: 1.393)

8.C.-J. Tong, Y.-C. Cheng, M.-T. Lin, Kuan-Jung Chung, J.-S. Hsu, and C.-L. Wu, “ Optical Micro-peddle Beam Deflection Measurement for electrostatic mechanical testing of Nano-scale Thin Film Application to MEMS”, Microsystem Technologies, Vol.16, No.7, pp.1131-1137, Jul. 2010. (SCI, 2012 IF: 0.827)

9.L. Yang, J. B. Bernstein, and K. Chung, “The Impact of Lead-Free Soldering on Electronic Packages”, Microelectronic International, Vol. 18, No.3, pp. 20-26, 2001. (SCI, 2012 IF: 0.731)

10.Sy-Wei Lo and K. Chung, “The Optimum Condition of Manufacturing a Smooth Engineered Surface Using the Internal – Ironing Process”, STLE Tribology Trans, Vol. 41, No. 4, pp. 563~571. Oct. 1998. (SCI, 2012 IF: 0.914)

1.Yu-Chang Lin, Kuan-Jung Chung, and Chueh-Chien Hsiao “A Novel Double Dynamic Stress Accelerated Degradation Test to Evaluate Power Fade of Batteries for Electric Vehicles”, Intelligent Technologies and Engineering Systems, Lecture Notes of Electrical Engineering, Vol. 234, pp. 161-168, 2013. (EI).

2.K. J. Chung, C. F. Lin, W. C. Chiang, “Effect of Strain Rates on the Mechanical Behavior of Cu Thin Films of Various Thicknesses”, Applied Mechanics and Materials, Vol. 284, pp 94-97, 2013. (EI)

3.鍾官榮、蔡銘吉、蕭玨騫，“溫度因子對磷酸鋰鐵電池充放電效能之影響初探”，研究與創新，第12期，頁7-12，中華民國一百年一月。

4.鍾官榮，“應用Norris-Landzberg加速壽命模型在球閘陣列封裝之可靠性評估”，興大工程學刊，第二十一卷，第二期，頁81-87，中華民國九十九年七月。

5.鍾官榮，“胎壓監控系統之壽命測試與破壞分析”，中華民國微系統暨奈米科技協會會刊，第22期，頁44-51，中華民國九十八年十二月。

6.林明澤，童麒嘉，鍾官榮，陳彥廷，“微奈米尺度薄膜材料機械性質量測與檢測技術發展研究與新式量測方法之介紹”，台中市儀器商業同業公會創會35週年記念專刊，頁39-48，中華民國九十八年七月。

7.Kuan-Jung Chung, J. B. Bernstein, and L. Yang, “Experimental Study of EFO Ward Electrode Wear and Surface Pollution in Wire Bonding Process”, Tamkang Journal of Science and Engineering (淡江理工學刊), Vol. 6, No. 1, pp. 43-48, Mar. 2003. (EI)

1.Ping Wun Huang, and Kuan-Jung Chung, “The Prediction of Positioning shift for a Robot Arm Using Machine Learning Techniques”, Proceedings of the 14^th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT 2019), pp.204-207, 2019.(EI)

2.Zuo-Xiang Gan, Han-Sheng Chen, Yu-Chang Lin, and Kuan-Jung Chung, “A Novel Disposable Electrochemical Sensor Packaging with Application for the Detection of Uric Acid”, Proceedings of the 13^th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT 2018), pp.1-4, 2018.(EI)

3.Jian-Hua Huang, Hui Min Cheng, Yi-Ru Li, and Kuan-Jung Chung, “Prognostic-Based Reliability Assessment of a Wafer Handling Robot Arm Using Wiener Stochastic Process Model and Monte Carlo Simulation”, Proceedings of the 24^th ISSAT International Conference on Reliability and Quality in Design (RQD 2018), pp.1-5, 2018.

4.Ping Wun Huang, Wen Han Zeng, and Kuan-Jung Chung, “Predicting Manpower Increase of Emergency Department for Influenza Epidemics Using Ensemble Learning Process”, The 9^th Asian Conference on Emergency Medicine & The Turkish Emergency Medicine Conference, Antalya, Turkey, Nov. 22-25., 2017.

5.Yi-Ru Li, and Kuan-Jung Chung, “Predicting the Degradation of Li-ion Battery Using Advanced Machine Learning Techniques”, Proceedings of the 12^th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT 2017), pp. 462-466, 2017.(EI)

6.Yu-Chang Lin, Yi-Ru Li, and Kuan-Jung Chung, “Estimating Activation Energy of the LiFePO₄ Battery Using Dual Dynamic Stress Accelerated Degradation Test”, Proceedings of the 23^rd ISSAT International Conference on Reliability and Quality in Design, pp. 121-125, 2017.

7.Kuan-Jung Chung, Yu-Chang Lin, and Bo-Han Wu, “Proactive-based Reliability Assessment of Handling Robot Arm”, Proceedings of the 2017 World Congress on Micro and Nano Manufacturing, pp.1-4, 2017.

8.Jung-Chi Chang, Siao-Syun Lin, Lian-Di Yao, and Kuan-Jung Chung, “Lifetime Prediction of Bidirectional Transient Voltage Suppression Diodes Using Highly-Accelerated Temperature and Humidity Stress Test”, Proceedings of the 11^th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT 2016), pp. 249-252, 2016.(EI)

9.Yu-Chang Lin, and Kuan-Jung Chung, “Predicting the Lifetimes of LiFePO₄ Batteries on the Basis of the Gamma Process Through Accelerated Degradation Measurements”, Proceedings of the 2016 IEEE International Conference on Prognostics and Health Management (IEEE PHM 2016), pp. 1-6, 2016. (EI)

10.Ching-Yu Chen, Rong-Fong Wu, Chun-Ying Huang, and Kuan-Jung Chung, “Lifetime Prediction of the Epoxy Resin Adhesive under the Optical Performance Degradation”, Proceedings of the 10^th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT 2015), pp. 400-403, 2015.(EI)

11.Kuan-Jung Chung, and Chia-Che Wu, “Development of a Leakage-free disposable package for biosensors immersed in the chemical solutions”, Proceedings of the 9^th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), and the 16^th International Conference on Electronics Materials and Packaging (EMAP), pp. 763-765, 2014.(EI)

12.Yu-Chang Lin, Chueh-Chien Hsiao, Kuan-Jung Chung, “Evaluating the Capacity Fade of Li-ion Batteries Using a Double Dynamic Stress Accelerated Degradation Test”, “ 1st International Symposium on Energy Challenges and Mechanics”, Aberdeen, Scotland, United Kingdom, 8-10 July, 2014.

13.Yu-Chang Lin, Kuan-Jung Chung, Chueh-Chien Hsiao, and Hsuan-Fu Wang “A Novel Double Dynamic Stress Accelerated Degradation Test to Evaluate Power Fade of Batteries for Electric Vehicles”, The 1^st International Conference on Intelligent Technologies and Engineering Systems (ICITES 2012), Changhua, Taiwan , Dec. 13-15, 2012.(Later collected in the Intelligent Technologies and Engineering Systems, Lecture Notes of Electrical Engineering, Vol. 234, pp. 161-168, 2013.(EI).

14.K. J. Chung, C. F. Lin, W. C. Chiang, “Effect of Strain Rates on the Mechanical Behavior of Cu Thin Films of Various Thicknesses”, The 2^nd International Conference on Engineering and Technology Innovation, Kaohsiung, Taiwan, Nov. 2-6, 2012. (Later collected in the Applied Mechanics and Materials, Vol. 284, pp 94-97, 2013) (EI).

15.Kuan-Jung Chung, Shiau-Shiun Lin, Chih-Cheng Chen, and Sen-Chou Tsai, “Reliability Tests of a RFID-Based Lock for Power Meter Applications”, Proceedings of IEEE 2012 International Symposium on Computer, Consumer, and Control, pp.945-948, 2012. (EI)

16.Chueh-Chien Shiao, and Kuan-Jung Chung, “Accelerated Degradation Assessment of 18650 Li-ion Batteries”, Proceedings of IEEE 2012 International Symposium on Computer, Consumer, and Control, pp.930-933, 2012. (EI)

17.Kuan-Jung Chung, Chih-Hao Tseng, and LiYu Yang, “The Solder Joint Reliability Assessment of a Wafer Level CSP Package”, The 6^th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, and SIPO International 3D IC Conference, pp.370-372, 2011. (EI)

18.Kuan-Jung Chung, Liyu Yang, Bing-Yu Wang, and Chia-Che Wu, “The Investigation of Modified Norris-Landzberg Acceleration Models for Reliability Assessment of Ball Grid Array Packages”, The 5^th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, and SIPO International 3D IC Conference, Oct. 2010. (EI)

19.Ming-Tzer Lin, Chi-Jia Tong, Ya-Chi Cheng, Kuan-Jung Chung, and Jiong-Shiun Hsu, “Measure the Mechanical Behavior of Thin Films Using Four Step Phase-Shifting Methods on the Novel Paddle Cantilever Beam Source”, Proceedings of Society for Experimental Mechanics - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2009, v 4, pp. 2387-2393, 2009. (EI)

20.Ming-Tzer Lin, Chi-Jia Tong, Ya-Chi Cheng, Kuan-Jung Chung, and Jiong-Shiun Hsu, “Mechanical Properties Study of Nano-Scale Thin Films on the Novel Paddle Cantilever Using Optical Interferometer with Four Step Phase-Shifting Method”, Proceedings of DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, pp. 140-144, 2009. (EI)

21.Yan-Ting Chen, Kuan-Jung Chung, and Ming-Tzer Lin, “Mechanical Property Measurement of Nano-Scale Argentum Films on the Novel Paddle Cantilever Beams Using Four Step Phase-Shifting Method”, Proceedings of IEEE International Conference on Electronics Materials and Packaging (EMAP’08) - the 3^rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10^th International Conference on Electronics Materials and Packaging (EMAP), pp.179-182, 2008. (EI)

22.Kuan-Jung Chung, Kuo-Jung Tseng, Siao-Syun Lin, Nikita Liao, and Ken-Yuan Lin, “Development and Verification of Accelerated Life Test Circuits for Tire Pressure Monitoring System”, Proceedings of IEEE 2008 Workshop on Accelerated Stress Testing and Reliability, 2008.

23.C.-J. Tong, M-T. Lin, Y.-T. Chen, Kuan-Jung Chung, and J.-S. Hsu, “Novel Mechanical Properties Measurement of Thin Films Using Paddle Cantilever Deflection”, ThinFilms 2008 and NanoMan 2008, 13-16 July, 2008, Singapore.

24.Chi-Feng Lin, Po-Hua Yang, and Kuan-Jung Chung, “Design of Hybrid Solar Concentrator”, International Symposium on Solar Cell Technologies, Dec. 5-6, 2008, Taipei, Taiwan.

25.Kuan-Jung Chung, Joseph B. Bernstein, JI Luo, J. Ari Tuchman, and Zheng K. Ma, “Experimental Study for Low Resistance Interline Connections Using Pulsed Laser Techniques”, Proceedings of Quantum Electronics and Laser Science Conference (QELS’05), v 3, pp. 1564-1566, 2005. (EI)

26.Ji Luo, Joseph B. Bernstein, J. Ari Tuchman, Hu Huang, Kuan-Jung Chung, and Anthony L. Wilson, “A High Performance Radiation-Hard Field Programmable Analog Array”, Proceedings of the 5^th International Symposium on Quality Electronic Design, ISQUED 2004, pp. 522-527, 2004. (EI)

27.Anthony L. Wilson, J. Luo, J. B. Bernstein, J. A. Tuchman, Hu Huang, and Kuan-Jung Chung, “A Continuous-Time Laser Programmable Analog Array for Radiation Environments”, 7^th Annual Mil/Aerospace Applications of Programmable Logic Devices International Conference (MAPLD), Sep. 8-10, 2004, Washington D. C., USA.

28.Ji Luo, Kuan-Jung Chung, Hu Huang, and J. B. Bernstein, “Temperature Dependence of R (on,sp) in Silicon Carbide and GaAs Schottky Diodes”, Annual Proceedings of IEEE International Reliability Physics Symposium, pp. 425-426, 2002. (EI)

29.Ji Luo, Kuan-Jung Chung, Hu Huang, and J. B. Bernstein, “Comparison Silicon Carbide Schottky Diodes”, Proceedings of 2001 IEEE GaAs Reliability Workshop, pp.13-14, 2001. (EI)

1.黃建樺、鍾官榮，“利用LSTM機器學習模型進行晶圓取放機械手臂之最大偏移量預測”，中國機械工程學會第三十六屆全國學術研討會論文集，台北，中華民國一百零九年十二月。

2.王順正、張起明、鍾官榮，“生物晶片的可靠度分析與評估”，中華民國品質學會第55屆年會暨2019國際品質管理研討會(ISQM)論文集，桃園，中華民國一百零八年十一月。

3.吳嘉興、王順正、鍾官榮、鄧妤庭，“車用ADAS晶片的可靠度分析與評估”，中華民國品質學會第55屆年會暨2019國際品質管理研討會(ISQM)論文集，桃園，中華民國一百零八年十一月。

4.張煜森、鍾官榮，“利用人工智慧法組合學習過程進行咖啡機的預測維護分析”，中華民國品質學會第53屆年會暨2017國際品質管理研討會(ISQM)論文集，桃園，中華民國一百零六年十一月。

5.甘佐祥、鍾官榮，“新型電化學生醫感測器之封裝與檢測驗證研究”，第二十屆全國機構與機器設計學術研討會論文集，彰化，中華民國一百零六年十一月。

6.鄭惠敏、鍾官榮，“應用類神經網路預測工業用高壓斷路器的絕緣電阻值與維修時機”，第二十屆全國機構與機器設計學術研討會論文集，彰化，中華民國一百零六年十一月。

7.黃炳文、曾玟瀚、鍾官榮，“以氣候條件為主要因子之流感病患盛行率風險評估”， 台灣急診醫學會2016年冬季學術討論會論文集，高雄，中華民國一百零五年十二月。

8.何照偉、鍾官榮，“應用機器學習之決策樹方法提高FMEA中嚴重度風險指標評分分級之準確度”，中華民國品質學會第52屆年會暨2016年國際品質管理研討會論文集，台南，中華民國一百零五年十一月。

9.吳柏翰、鍾官榮，“可撓式金屬添加物/石墨烯超級電容器製備及彎曲疲勞特性研究”，中華民國力學學會第39屆全國力學會議論文集，台北，中華民國一百零四年十一月。

10.甘佐祥、鍾官榮，“利用Gamma隨機過程衰退模型預估磷酸鋰鐵動力電池之老化壽命”，中國機械工程學會第三十二屆全國學術研討會論文集，高雄，中華民國一百零四年十二月。

11.林柏成、鍾官榮，“磷酸鋰鐵動力電池之加速老化測試及壽命預估”，中國機械工程學會第三十二屆全國學術研討會論文集，高雄，中華民國一百零四年十二月。

12.李竣煒、鍾官榮，“應用田口法於鋰電池在不同溫度及脈衝充電最佳化參數之研究”，中國機械工程學會第三十一屆全國學術研討會論文集，台中，中華民國一百零三年十二月。

13.藍永森、鍾官榮，“應用新雙動態應力加速試驗於磷酸鋰鐵動力電池之老化壽命預估”，中國機械工程學會第三十一屆全國學術研討會論文集，台中，中華民國一百零三年十二月。

14.張榮吉、黃敬洲、鍾官榮，“維修精密定位環之振動分析”，中華民國振動噪音工程學會第22屆學術研討會論文集，彰化，中華民國一百零三年六月七日。

15.曾致豪、鍾官榮，“以黃光微影製程製作表面聲波無線射頻標籤之研究”，2013 第七屆智慧型系統工程應用研討會論文集，台南，中華民國一百零二年五月。

16.邱俊瑋、鍾官榮、吳嘉哲，“碟閥性能量測系統之研製”，中國機械工程學會100年度暨第28屆全國學術研討會論文集，台中，中華民國一百年十二月。

17.林孝勳、曾致豪、陳永峰、鍾官榮，“RFID防盜鎖的設計與分析”，第六屆智慧生活科技研討會(ILT 2011)，台中，中華民國一百年六月。

18.詹前偉、蕭玨騫、鍾官榮、楊雅量，“紫外光固化快速成型生醫用多孔支架”，2011精密機械與製造科技研討會論文集(PMMT 2011)，屏東，中華民國一百年五月。

19.蔡銘吉，鍾官榮，“磷酸鋰鐵電池之充放電系統製作與溫度對電池性能影響之研究”，2010安全管理與工程技術國際研討會論文集(ICSSMET2010)，嘉義，中華民國九十九年十一月。

20.鍾官榮、林孝勳，“胎壓監控系統加速壽命測試電路之研製”，2009第八屆可靠度與維護度技術研討會論文集，雲林，中華民國九十八年十二月。

21.張榮吉、褚政怡、郭永源、張右龍、鍾官榮，“車電產品之溫度效應影響可靠度預估分析”，2009第八屆可靠度與維護度技術研討會論文集，雲林，中華民國九十八年十二月。

22.江偉成、林奇鋒、鍾官榮、楊博華，“金屬薄膜於不同應變速率下之機械性質分析”，2009精密機械與製造科技研討會論文集，屏東，中華民國九十八年五月。

23.陳法志、林奇鋒、鍾官榮，“Rulon 工程塑膠在不同荷載速率下之機械性質分析”，2008彰雲嘉院校聯盟學術研討會論文集，彰化，中華民國九十七年十二月。

24.吳嘉哲、宋孟桓、陳麗同、鍾官榮，“鋯鈦酸鉛薄膜之性質量測及其在發電裝置應用之研究”，2008彰雲嘉院校聯盟學術研討會論文集，彰化，中華民國九十七年十二月。

25.Kuan-Jung Chung, J. B. Bernstein, and M. Peckerar, “Design Optimization of the Laser-Formed Microbridge for Low Resistance Interline Connection”, 11^th Nano and Microsystem Technology Conference, Aug. 2007, Taichung, Taiwan.

26.Kuan-Jung Chung, and Joseph B. Bernstein, “Electromigration Evaluation of the Micorbridge Process for Low Resistance Interline Connectors in ICs”，中華民國第七屆可靠度與維護度技術研討會論文集，新竹，中華民國九十六年六月。

27.鍾官榮、王慶順、陳永樹、林育才、陳雲岫、彭鴻霖，“太空級微電子元件可靠度評估系統建構”，中華民國第七屆可靠度與維護度技術研討會論文集，新竹，中華民國九十六年六月。

28.鍾官榮，羅斯維，洪祖成，“金屬成形低速潤滑之實驗探討”，中國機械工程協會第14屆學術研討會論文集，桃園，中華民國八十六年十二月。

29.Sy-Wei Lo, and K. Chung, “Development of Smooth Engineered Surfaces by Internal-Ironing Process”，中國機械工程協會第14屆學術研討會論文集，桃園，中華民國八十六年十二月。

1.鍾官榮、林育漳、劉衍宗，“離心式定量點藥取放裝置”，中國大陸發明專利，專利號：ZL 2015 1 0081566.6，專利期間：2015/02/15~2035/02/14。

2.鍾官榮、林育漳、劉衍宗，“汲取式定量點藥取放裝置”， 中國大陸發明專利，專利號：ZL 2015 1 0043526.2，專利期間：2015/01/28~2035/01/27。

3.鍾官榮、林育漳，“垂直存取式的藥物篩選裝置”，中國大陸新型專利，專利號：ZL 2015 2 0063540.4，專利期間：2015/01/29~2025/01/28。

4.鍾官榮、吳柏翰，“工具機具殘餘使用壽命預測系統及其方法”，中華民國發明專利，證書號數：I639907，專利期間：2018/11/01~2037/06/05，(MOST 106-2622-E-018-001 -CC2)。

5.鍾官榮、林育漳、劉衍宗，“汲取式定量點藥取放裝置”，中華民國發明專利，證書號數：I555578，專利期間：2016/11/01~2035/01/19。

6.鍾官榮、林育漳、劉衍宗，“離心式定量點藥取放裝置”，中華民國發明專利，證書號數：I551350，專利期間：2016/10/01~2035/02/09。

7.鍾官榮、李欣蓓，“立體堆疊晶片封裝方法”，中華民國發明專利，證書號數：I539569，專利期間：2016/06/21~2033/12/08。

8.鍾官榮、林育漳，“表面聲波元件的腔體形成方法”，中華民國發明專利，證書號數：I501549，專利期間：2015/09/21~2033/12/10。

9.鍾官榮、林育漳，“多向性表面聲波無線辨識模組”，中華民國發明專利，證書號數：I501158，專利期間：2015/09/21~2033/08/15。

10.鍾官榮、林育漳，“防滲液的生化試片以及其製備方法”，中華民國發明專利，證書號數：I500928，專利期間：2015/09/21~2034/03/03。

11.鍾官榮、邱俊瑋，“碟閥性能量測系統”，中華民國發明專利，證書號數：I439665，專利期間：2014/06/01~2031/05/12，(NSC 99-2622-E-018 -002 -CC3)。